First Annual IC and Distribution Summit Opens in Shenzhen
An international conference exploring the future of China in the global electronics design and manufacturing world opened today in Shenzh...
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Xilinx Details SoC-like FPGAs
Xilinx released the first details of its next-generation Everest architecture, now called Versal. It shows the microprocessor landscape ...
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TSMC Goes Photon to Cloud
TSMC taped out its first chip in a process making limited use of extreme ultraviolet lithography and will start risk production in Apri...
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Startup’s AI Chip Beats GPU
A startup with ties to Amazon is sampling a 16-nm chip mainly targeted for data centers that it claims handily beats CPUs and GPUs f...
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Macronix Plans Low-Cost 3D NAND
Miin Wu believes that he can cut 3D NAND prices by a third. The founder of Macronix is raising funds for a three-year effort that i...
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New Chip Seen Boosting Huawei’s Market Share
Huawei, which hasovertaken Appleto become the new No. 2 in smartphones, is expected to increase its market share with the introduction of...
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